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| Data sheet acquired from Harris Semiconductor SCHS015C - Revised August 2003 The CD4001B, CD4002B, and CD4025B types are supplied in 14-lead hermetic dual-in-line ceramic packages (F3A suffix), 14-lead dual-in-line plastic packages (E suffix), 14-lead small-outline packages (M, MT, M96, and NSR suffixes), and 14-lead thin shrink small-outline packages (PW and PWR suffixes). Copyright 2003, Texas Instruments Incorporated MECHANICAL MPDI002C - JANUARY 1995 - REVISED DECEMBER 20002 N (R-PDIP-T**) 16 PINS SHOWN PLASTIC DUAL-IN-LINE PACKAGE PINS ** DIM A 16 9 A MAX 14 0.775 (19,69) 0.745 (18,92) 16 0.775 (19,69) 0.745 (18,92) 18 0.920 (23,37) 0.850 (21,59) 20 1.060 (26,92) 0.940 (23,88) A MIN 0.260 (6,60) 0.240 (6,10) C MS-100 VARIATION AA BB AC AD 1 0.070 (1,78) 0.045 (1,14) D 8 0.045 (1,14) 0.030 (0,76) D 0.020 (0,51) MIN 0.325 (8,26) 0.300 (7,62) 0.015 (0,38) 0.200 (5,08) MAX Seating Plane 0.125 (3,18) MIN 0.010 (0,25) NOM Gauge Plane 0.100 (2,54) 0.021 (0,53) 0.015 (0,38) 0.010 (0,25) M 0.430 (10,92) MAX 14/18 PIN ONLY 20 pin vendor option D 4040049/E 12/2002 NOTES: A. All linear dimensions are in inches (millimeters). B. This drawing is subject to change without notice. C. Falls within JEDEC MS-001, except 18 and 20 pin minimum body lrngth (Dim A). D. The 20 pin end lead shoulder width is a vendor option, either half or full width. POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 1 MECHANICAL DATA MSOI002B - JANUARY 1995 - REVISED SEPTEMBER 2001 D (R-PDSO-G**) 8 PINS SHOWN 0.050 (1,27) 8 5 0.020 (0,51) 0.014 (0,35) 0.010 (0,25) PLASTIC SMALL-OUTLINE PACKAGE 0.244 (6,20) 0.228 (5,80) 0.157 (4,00) 0.150 (3,81) 0.008 (0,20) NOM Gage Plane 1 A 4 0- 8 0.044 (1,12) 0.016 (0,40) 0.010 (0,25) Seating Plane 0.069 (1,75) MAX 0.010 (0,25) 0.004 (0,10) 0.004 (0,10) PINS ** DIM A MAX A MIN 8 0.197 (5,00) 0.189 (4,80) 14 0.344 (8,75) 0.337 (8,55) 16 0.394 (10,00) 0.386 (9,80) 4040047/E 09/01 NOTES: A. B. C. D. All linear dimensions are in inches (millimeters). This drawing is subject to change without notice. Body dimensions do not include mold flash or protrusion, not to exceed 0.006 (0,15). Falls within JEDEC MS-012 POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 1 MECHANICAL DATA MTSS001C - JANUARY 1995 - REVISED FEBRUARY 1999 PW (R-PDSO-G**) 14 PINS SHOWN PLASTIC SMALL-OUTLINE PACKAGE 0,65 14 8 0,30 0,19 0,10 M 0,15 NOM 4,50 4,30 6,60 6,20 Gage Plane 0,25 1 A 7 0- 8 0,75 0,50 Seating Plane 1,20 MAX 0,15 0,05 0,10 PINS ** DIM A MAX 8 14 16 20 24 28 3,10 5,10 5,10 6,60 7,90 9,80 A MIN 2,90 4,90 4,90 6,40 7,70 9,60 4040064/F 01/97 NOTES: A. B. C. D. All linear dimensions are in millimeters. This drawing is subject to change without notice. Body dimensions do not include mold flash or protrusion not to exceed 0,15. Falls within JEDEC MO-153 POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 1 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are sold subject to TI's terms and conditions of sale supplied at the time of order acknowledgment. TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI's standard warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarily performed. TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and applications using TI components. To minimize the risks associated with customer products and applications, customers should provide adequate design and operating safeguards. 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TI is not responsible or liable for such altered documentation. Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements. 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